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TOSEI ENGINEERING CORP. > Edge Shaping Products > Wafer Edge Grinding Machine
Wafer Edge Grinding Machine
“W-GM series” Wafer Edge Grinding machines, that the improvement of its performance never stops, are used in production lines of all over the world.
The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important.
The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.
Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process.
The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials.
Wafer edge grinding machine also draws the attention as a solution for the yield loss due to the knife edge of device wafer in the back end process.
In the semiconductor manufacturing process, from the wafer manufacturing to the device manufacturing, the quality improvement of wafer edge is necessary in recent years.We make proposals that achieve the improvement of quality, CoO and yield with our machine.
Applications Example
Applications Example
What Edge Grinder is
It is also called as Edge Grinding Machine, Beveling Machine and Rounding Machine.
It grinds the edge part of substrates and wafers.
Screen Layout of Edge Grinder
Easy Operation and High Quality Graphic Screen with Icon Buttons and Touch Panel Display.
Wafer Edge Grinding Machine W-GM-4200 Series (4200E, 4250)
- 2 Grinding Stages with 4-cassette Loader.
- It’s a machine of W-GM series for 2″ to 8″ wafer production.
- Easy operation by touch screen and the graphical user interface.
Materials:
Silicon, Sapphire and compound materials such as SiC
| Wafer Size | 2″ to 6″ or 4″ to 8″ |
|---|---|
| Materials | Silicon, Sapphire, SiC, GaN, LT, LN, GaAs, Glass and Ceramics, Compound Materials, Crystal Materials and Sintering Materials |
| Options | Notch Grinding, Low Damage Grinding, HOST communication |
| Grinding Stage | 2-stage |
| Cassette Loader | 4C, 8C or 12C |
Wafer Edge Grinding Machine W-GM-5200 Series (5200E)
- 2 Grinding Stages with 8-cassette Loader.
- It’s a 2-stage machine of W-GM Series for 12″ wafer production.
| Wafer Size | 12″ |
|---|---|
| Materials | Silicon, Glass, Ceramics, Compound Materials, Crystal Materials and Sintering Materials |
| Options | Notch Grinding, Low Damage Grinding, HOST communication |
| Grinding Stage | 2-stage |
| Cassette Loader | 8C |
Wafer Edge Grinding Machine W-GM-4100 Series
- It’s a compact and cost effective 1-stage machine with features that we have accumulated with mass production machines of W-GM series.
- Options for grinding various types of wafer shape and other customized features are available.
| Wafer Size | 2″ ~ 8″ |
|---|---|
| Materials | Silicon, Sapphire ,SiC , GaN, LT,LN, GaAs, Glass and Ceramics, Compound Materials, Crystal Materials and Sintering Materials |
| Options | Notch Grinding, HOST communication |
| Grinding Stage | 1-stage |
| Cassette Loader | 2C |
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