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Example
Machine Models Used in Grinding Service: W-GM series
Edge Grinding of Silicon Wafer
Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology.
It is capable with as-cut wafer, lapped wafer and etched wafer.
It is capable with as-cut wafer, lapped wafer and etched wafer.
Wafer Size: 2″ to 18″
Shrinking of wafer size such as 12″ ･ 8″ or 4″ ･ 3″ is also possible.
Edge Grinding of Sapphire Wafer
Edge Grinding of Sapphire Wafer with Flat or Notch.
Mirror finish edge grinding of Ra = 20 nm is also possible.
Mirror finish edge grinding of Ra = 20 nm is also possible.
Edge Grinding of Special Shape Wafer
Various types of grinding will be possible by selection of grinding wheels and changing the grinding program. Please feel free to ask us.
Edge Grinding of Compound Materials and Glass Wafer
Grinding of compound materials such as SiC, GaN, GaAs, LiTa and Glass is possible.
Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology.
Mirror finish edge grinding of Ra = 20 nm is achieved by our helical grinding technology.
Ingot Rounding
It is possible to round an ingot of compound materials or glass that thickness is around 30mm.
Edge Grinding of Tiny Wafer
Edge grinding of wafers that diameter is less than 50mm such as lens cover is possible.
It is capable with various kinds of materials such as silicon, glass and sapphire.
It is capable with various kinds of materials such as silicon, glass and sapphire.
Square / Rectangle Wafer Edge Grinding
- Super Finishing of Edge
- Rounding and Beveling
CFRP (Carbon Fiber Reinforced Plastic), Sapphire, SiC (Silicon Carbide), Zilconia, Lithium Tantalate.
We propose special tools and process for any materials that are difficult to cut.
Mirror Finish Edge Grinding for Compound Materials “IMET Process”
- Wafer edge can be mirror finished by the edge grinding process.
- Roughness of Ra = 20 nm is achieved (SiC).
- It reduces the cost by shortening the manufacturing process and improving the yield.
- The recipe is optimized for each wafer material.
- High Productivity by Higher Speed for Rough Grinding.
- Material of Wafer: Compound Materials, Sapphire and Glass
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