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Grinding Service

From small number of test grinidng to large number of lot process, please feel free to ask us.

We provide the grinding service using our wafer edge grinding machine with the highly accurate grinding technology.
Our wafer edge grinding machine is used for various materials such as silicon, sapphire, compound materials and glass.

» Examples of Grinding Type are here

W-GM-4250


Evaluation of Wafer

Evaluation of Wafer

Also, we have measuring instruments that are developed by our metrology division and other industry standard measuring systems, and we can measure your wafers for your evaluation.
We believe that it is useful for your development or production.

» Examples of Wafer Evaluation are here


Flow of Grinding Service
  • Inquiry
  • →
  • Confirmation of Requirements
  • →
  • Shipment of Work Piece before Processing
  • →
  • Processing and Evaluation
  • →
  • Shipment of Work Piece after Processing
InquiryInquiry


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