EDGE-加工製品情報 > Edge Shaping Products | TOSEI ENGINEERING CORP. > Wafer Demounting & Cleaning Machine
TOSEI ENGINEERING CORP. > Edge Shaping Products > Wafer Demounting & Cleaning Machine

Wafer Demounting & Cleaning Machine

Wafer Demounting & Cleaning Machine C-RW-200 / 300 / 450

Wafer Demounting & Cleaning Machine
This is a multifunctional cleaning machine that cleans an ingot after slicing, demounts each wafer from the base plate, cleans wafers after demounting and stores them into a cassette.


  • We have product line-up for 200 mm, 300 mm, 450 mm wafer and customized design is also available.
  • The machines are capable with oil slurry or water-soluble slurry, and the cleaning water can be recycled by a filter and it reduces the running cost.
  • The loader is designed for a base plate of each wire-saw maker and an ingot can be loaded in the machine with using an ingot lifter of each wire-saw.
  • High Throughput
Options

Marking, Thickness measuring, Detection of remaining glue on wafer edge, flipping of wafer and storing to different type of cassette.

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